Coming Soon
Schedule
September 2026 M T W T F S S 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 Class Calendar
- Paige October 24, 2026 at 3:00 pm – 4:00 pm
Contact
Office hours by appointment
email: Johnsson@cs.uh.edu
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JEDEC- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- Open Compute Project Foundation and JEDEC Drive Open Silicon Innovation
- JEDEC® Announces Updates to Universal Flash Storage (UFS) and Memory Interface Standards
- JEDEC® Announces Enhanced NAND Flash Interface Standard with Increased Speeds and Efficiency
- JEDEC® Publishes LPDDR5 CAMM2 Connector Performance Standard
- JEDEC® to Launch New Raw Card DIMM Designs with DDR5 Clock Drivers, Enhancing Client Computing Memory Performance and Stability at 6400 Mbps and Beyond
- JEDEC® Adds to Suite of Standards Supporting Compute Express Link® (CXL®) Memory Technology with Publication of Two New Documents
- JEDEC Publishes Essential Test Method to Address Switching Energy Loss in Wide Bandgap and Silicon Semiconductor Power Devices
- JEDEC Releases New Standard for LPDDR5/5X Serial Presence Detect (SPD) Contents
- Discover the Future of Automotive Electronics: Join JEDEC’s Forum in San Jose on September 19th
HPC Wire- Synopsys and Amazon Expand Partnership for Custom Silicon and AI Chip Design
- Everpure Enhances Data Intelligence to Bolster Customer AI Projects
- Everspin Demonstrates CXL-Connected MRAM at SNIA Developer Conference 2026
- AMD Lands Fei-Fei Li, the ‘Godmother of AI,’ In $8.2B World Labs Buy
- SC26 Test of Time Award Recognizes Lasting Work in GPU Sparse Computing
- SEMIFIVE Signs $52M AI Chip Development Deal with US Company
- Roadrunner Quantum Lab Opens in Albuquerque with IonQ, Diraq and QuEra Among Initial Tenants
- Samsung Commits $1B to Helix Digital Infrastructure to Support Global AI Infrastructure Buildout
- LiquidStack CDU 2.X Brings Flexible Cooling to AI and HPC Data Centers
- Hardware Alone Won’t Drive the Next Revolution in Scientific Computing
IDC- IDC:新品密集迭代,2025年前三季度全球腕戴设备市场同比增长10%
- IDC:进入新品密集发布期,三季度中国智能眼镜市场出货量持续攀升
- 2025年上半期の国内セキュリティソフトウェア市場は前年比14.1%成長 ~ IDC Worldwide Semiannual Software Tracker を発行~
- 2025年上半期の国内ソフトウェア市場は前年比11.7%成長 ~IDC Worldwide Semiannual Software Tracker を発行~
- 国内金融IT市場最新予測を発表~既存システム刷新などにより2029年までは市場拡大を予測、ただしユーザーIT支出の変化に注意~
- Enterprise WLAN Market Grew 7.8% in the Third Quarter of 2025, according to IDC Worldwide WLAN Tracker
- Global XR Shipments Rebound Behind Glasses-First Momentum, IDC Reports
- Worldwide Ethernet Switch Market Grew 35.2% in the Third Quarter of 2025, according to IDC’s Quarterly Ethernet Switch Tracker
- Worldwide External Enterprise Storage Systems Market Revenue Increased 2.1% During the Third Quarter of 2025, according to IDC
- Worldwide Server Market Revenue Increased 61% During the Third Quarter of 2025, according to IDC
NSF Funding- NSF Graduate Research Fellowship Program (GRFP)
- Expeditions in Computing (Expeditions)
- Emerging Frontiers in Research and Innovation (EFRI): Wave-Based Computing (WBC) (EFRI-WBC)
- MPS Physics Research Programs (MPS Physics)
- MPS Astronomical Sciences Research Programs (MPS Astro)
- MPS Materials Research Programs (MPS Materials)
- MPS Mathematical Sciences Research Programs (MPS MathSci)
- MPS Chemistry Research Programs (MPS Chem)
- Engineering (ENG): Chemical, Bioengineering, Energy, and Transport Systems (CBET)
- Core Research in Biological Sciences (BIO Core)