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- JEDEC
- JEDEC to Enable Standard 3D Models of Electronic Components November 27, 2018
- JEDEC Events: Memory Tutorials, Mobile/IOT & Automotive Forums February 21, 2018
- JEDEC Publishes Universal Flash Storage (UFS & UFSHCI) Version 3.0 and UFS Card Extension Version 1.1 January 30, 2018
- JEDEC Revises Access to Published Standards and Documents January 25, 2018
- New JEDEC Committee for Wide Bandgap Power Semiconductors Invites Industry Participation December 20, 2017
- HPC Wire
- CFD on ORNL’s Titan Simulates Cleaner, Low-MPG ‘Opposed Piston’ Engine
- Contract Signed for New Finnish Supercomputer
- TYAN Introduces Entry Server Platforms Optimized for the New Intel Xeon E-2100 Processors
- WekaIO Expands European Presence, Appoints Derek Burke as UK Sales Leader
- NCSA Partners with Uni High, Offering Research Opportunities for Local Students
- IDC
- NSF Funding
- Dear Colleague Letter: NSF Special Guidelines for Submitting Collaborative Proposals Under the SBE-UKRI Lead Agency Opportunity
- Harnessing the Data Revolution (HDR): Institutes for Data-Intensive Research in Science and Engineering - Ideas Labs (I-DIRSE-IL)
- Dear Colleague Letter: Leadership-Class Computing Allocations
- Mid-scale Research Infrastructure-2 (Mid-scale RI-2)
- Dear Colleague Letter: Seeking Community Input for International Research Experiences for Graduate Students
- Future of Work at the Human-Technology Frontier: Core Research (FW-HTF)
- Dear Colleague Letter: Request for Information - Integration Institutes for Cross-cutting Biology
- Dear Colleague Letter: Supporting Transition to Practice Supplemental Funding Requests in the NSF Cyber-Physical Systems and Smart and Connected Communities Programs
- Dear Colleague Letter: STEM Workforce Development Utilizing Flexible Personal Learning Environments
- Frequently Asked Questions (FAQs) for Improving Undergraduate STEM Education: Hispanic-Serving Institutions (HSI) Program
