Coming Soon
The Green Grid- An error has occurred; the feed is probably down. Try again later.
- JEDEC
- JEDEC Announces Task Group to Define High Temperature Flatness Requirements and Metrology for Connectors and PCB Footprints April 13, 2017
- JEDEC DDR5 & NVDIMM-P Standards Under Development March 30, 2017
- JEDEC Updates Standards for Low Power Memory Devices March 8, 2017
- JEDEC Announces Annual Serial Presence Detect Enhancements August 16, 2016
- JEDEC Launches Quality & Reliability Task Group in China; Invites Industry Participation April 12, 2016
- HPC Wire
- IDC
- Worldwide SMB IT Spending to Top $676 Billion in 2021, Driven by Software and Services Growth, According to IDC
- IDC Expects IaaS Spending to Surpass SaaS Spending for the First Time in 2017
- CEE and Notebooks, Main Drivers of the EMEA Traditional PC Market Recovery, says IDC
- New IDC PeerScape Outlines Best Practices for Cloud Computing Adoption by Higher Education and Research
- Business Process Outsourcing (BPO) Market will Soar to US$ 1.4 billion by 2021 in Malaysia
- NSF Funding
- CISE Research Infrastructure (CRI)
- Dear Colleague Letter: Removal of Deadlines for the Process Separations Program in the Division of Chemical, Biological, Environmental, and Transport Systems in the Directorate for Engineering
- NSF Earth Sciences Postdoctoral Fellowships (EAR-PF)
- Paleo Perspectives on Climate Change (P2C2)
- Division of Materials Research: Topical Materials Research Programs (DMR-TMRP)
- Dear Colleague Letter: NSF/NSFC Joint Research on Environmental Sustainability Challenges
- Louis Stokes Alliances for Minority Participation (LSAMP)
- Emerging Frontiers in Research and Innovation 2018 (EFRI 2018)
- EarthScope
- Secure and Trustworthy Cyberspace (SaTC)
