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- JEDEC
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- Open Compute Project Foundation and JEDEC Drive Open Silicon Innovation
- JEDEC® Announces Updates to Universal Flash Storage (UFS) and Memory Interface Standards
- JEDEC® Announces Enhanced NAND Flash Interface Standard with Increased Speeds and Efficiency
- JEDEC® Publishes LPDDR5 CAMM2 Connector Performance Standard
- JEDEC® to Launch New Raw Card DIMM Designs with DDR5 Clock Drivers, Enhancing Client Computing Memory Performance and Stability at 6400 Mbps and Beyond
- JEDEC® Adds to Suite of Standards Supporting Compute Express Link® (CXL®) Memory Technology with Publication of Two New Documents
- JEDEC Publishes Essential Test Method to Address Switching Energy Loss in Wide Bandgap and Silicon Semiconductor Power Devices
- JEDEC Releases New Standard for LPDDR5/5X Serial Presence Detect (SPD) Contents
- Discover the Future of Automotive Electronics: Join JEDEC’s Forum in San Jose on September 19th
- HPC Wire
- Google Cloud Introduces Ironwood TPU and New Axion Instances for Large-Scale AI
- Red Hat Introduces Confirmed Sovereign Support for European Union
- Qilimanjaro Launches Multimodal Quantum Data Center in Barcelona
- Nebius Launches Token Factory to Deliver Production AI Inference at Scale
- DARPA Selects 11 Participants for Quantum Benchmarking Initiative Stage B
- Metagenomi Speeds Its Gene Editing Research with AWS, AI
- UK Details Major Quantum Investments as 2025 National Quantum Technologies Showcase Begins
- Quantinuum Selected by DARPA to Advance to Stage B of Quantum Benchmarking Initiative
- Photonic Inc. Advances to Stage B of DARPA’s Quantum Benchmarking Initiative
- NVIDIA: Jensen Huang and Bill Dally Awarded Prestigious Queen Elizabeth Prize for Engineering
- IDC
- With Telecom Services Spending Growing Less than 2% Annually, Operators Turn to AI to Boost EBITDA Margins
- 智能重构金融未来——IDC发布智能体最佳实践案例，揭示保险与资管创新样本
- IDC Announces ASEAN Winners of the 2025 IDC Future Enterprise Awards
- IDC：不止于人形，具身智能驱动新一代服务机器人：中国厂商技术与应用分析
- IDC发布2026全球IT行业十大预测：塑造未来IT领导力的三大力量
- AI Infrastructure Investments Surge Across Key APeJC* Markets Fueling a Wave of AI and GenAI Innovation
- Artificial Intelligence Infrastructure Spending to Reach $758Bn USD Mark by 2029, according to IDC
- IDC: India’s Enterprise Infrastructure* Market Reaches New Heights on the Back of Hyperscaler Investments and Data Localization Push
- IDC Announces Winners of the 2025 IDC Future Enterprise Awards in Hong Kong
- IDC：大模型市场双线爆发，开源+多模态释放AI商业化潜能
- NSF Funding
- NSF National Innovation Corps Teams (NSF National I-Corps (TM) Teams) program
- Accelerating Research Translation (ART)
- Research on Innovative Technologies for Enhanced Learning (RITEL)
- NSF Graduate Research Fellowship Program (GRFP)
- Foundations for Operating the National Artificial Intelligence Research Resource: the NAIRR Operations Center (NAIRR-OC)
- NSF STEM K-12 (STEM K-12)
- Integrated Data Systems & Services (IDSS)
- Computer and Information Science and Engineering : Future Computing Research (Future CoRe)
- Smart Health and Biomedical Research in the Era of Artificial Intelligence and Advanced Data Science (SCH)
- Test Bed: Toward a Network of Programmable Cloud Laboratories (PCL Test Bed)
Author Archives: rcmendez217
In Brief
Research Interests Professor Johnsson’s research interests are in the areas of High-Performance and Energy Efficient computer system design, programming and operation, parallel algorithms, adaptive software and tools for creation thereof, auto-tuning, performance modelling, and middle-ware. Multi-core and SoC dsigns are … Continue reading
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Dr. Lennart Johnsson 