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- JEDEC
- JEDEC Publishes Major Update to JEP30 PartModel Guidelines
- JEDEC Expands CAMM Standardization to include Two Key Memory Technologies
- JEDEC Creates New Automotive Steering Subcommittee
- JEDEC Wide Bandgap Power Semiconductor Committee Publishes a Series of Documents for Reliability and Testing of Silicon Carbide (SiC) MOSFETs
- JEDEC and Open Compute Project Foundation Form New Collaboration
- JEDEC Publishes Automotive Solid State Drive (SSD) Device Standard
- JEDEC Announces Publication of the SPD5118 Hub and Serial Presence Detect Device and the DDR5 SPD Contents Specifications
- CXL Consortium and JEDEC Sign MOU Agreement to Advance DRAM and Persistent Memory Technology
- JEDEC Updates Universal Flash Storage (UFS) and Supporting Memory Interface Standard
- JEDEC to Host In-Person Memory Forum and DDR5 Workshop
- HPC Wire
- IBM and BSC Pledge to Shape the ‘Future of Computing’ in Expanded Partnership
- Teledyne LeCroy Unveils High Performance Summit M616 PCIe 6.0 Protocol Analyzer/Exerciser
- Pritzker Molecular Engineering Researchers ‘Split’ Phonons – or Sound – in Step Toward New Type of Quantum Computer
- Expanse Supercomputer Aids in Nanoparticle Assembly Research
- TSMC Releases May 2023 Revenue Report
- Transaction Processing Performance Council Announces 15th Annual Technology Conference
- Micron Signs 178-Megawatt Wind Power Agreement with Terra-Gen
- ACM SIGHPC’s Annual Emerging Woman Leader in Technical Computing Award Opens for Nominations
- ISARA and LightBridge Group Partner to Advance Post-Quantum Cryptography in Government
- SC’s HPC Immersion Program Breaks Down Barriers in High Performance Computing
- IDC
- IDC：中国数字化转型支出将以17.9%的年复合增长率增长，增速位于全球前列
- IDC：逆境中寻求突破，2023第一季度中国IT安全硬件市场规模同比增长7.8%
- Digital Label & Packaging Market Thrives in Asia/Pacific* Amid Economic Downturn, IDC Finds
- Hardcopy Peripherals Market Surges 13.8% in Asia/Pacific* - Consumer and Commercial Demand Fuels Unprecedented Growth, IDC Reports
- IDC Directions Japanを開催
- Demand for Improved Resiliency and Automation Will Drive European Software Market Growth until 2027, Says IDC
- IDC：教育行业需求开始回暖，2023年PC出货量预计达281万台，线上购买占比持续增大
- 国内IoT市場は産業分野では製造業、技術分野ではソフトウェアを中心に成長
- IDC：2023年4月大尺寸顯示面板出貨量觸底，2023下半年產業大者恆大格局有利大尺寸顯示面板價格支撐
- IDC：一季度中国智能手表市场出货下跌16.7%，，手环市场率先回暖
- NSF Funding
- Dear Colleague Letter: NSF Collaborates with Canada's 2023 International Joint Initiative for Research on Climate Change Adaptation and Mitigation Competition
- Dear Colleague Letter: Special Guidelines for Submitting Collaborative Proposals under the U.S. NSF/GEO - DFG/Geosciences Lead Agency Opportunity on collaborative Research on Climate Change
- Discovery Research PreK-12 (DRK-12)
- Centers of Research Excellence in Science and Technology (CREST Centers)
- Geoinformatics (GI)
- Dear Colleague Letter: Special Guidelines for Submitting Collaborative Proposals under U.S. National Science Foundation (NSF) and the Department of Science and Technology (DST) of India Collaborative Research Opportunities
- Workplace Equity for Persons with Disabilities in STEM and STEM Education
- Dear Colleague Letter: Advancing Microelectronics Education
- Dear Colleague Letter: Directorate for Geosciences (GEO) Opportunity for Graduate Students Supplemental Funding to Link Geosciences and Human Health (GeoHealth INTERN)
- Expanding TRIPODS through Partnerships (XTRIPODS)
Author Archives: rcmendez217
In Brief
Research Interests Professor Johnsson’s research interests are in the areas of High-Performance and Energy Efficient computer system design, programming and operation, parallel algorithms, adaptive software and tools for creation thereof, auto-tuning, performance modelling, and middle-ware. Multi-core and SoC dsigns are … Continue reading
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Dr. Lennart Johnsson 