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- JEDEC
- JEDEC Publishes XFM Embedded and Removable Memory Device Standard to Expand Storage Solutions in Embedded and Automotive Applications August 25, 2021
- JEDEC Publishes New and Updated Standards for Low Power Memory Devices Used in 5G and AI Applications July 28, 2021
- SAE International and JEDEC Sign Standards Cooperation Agreement for Microelectronic Use in Aviation, Space and Defense July 6, 2021
- JEDEC Wide Bandgap Power Semiconductor Committee Publishes a Milestone Document for Bias Temperature Instability of Silicon Carbide (SiC) MOS Devices April 29, 2021
- JEDEC Publishes DDR4 NVDIMM-P Bus Protocol Standard February 17, 2021
- HPC Wire
- Intel Splits HPC Group, Creates Two ‘Supercompute’ Groups
- MosaicML, Led by Naveen Rao, Comes Out of Stealth Aiming to Ease Model Training
- Toyota Moves High Performance Workloads to Oracle Cloud
- Molecular Sciences Software Institute Receives $15M NSF Grant
- Ansys LS-DYNA Software Now Supports Fujitsu’s PRIMEHPC Supercomputers
- IDC
- NSF Funding
- Principles and Practice of Scalable Systems (PPoSS)
- Biodiversity on a Changing Planet (BoCP)
- CISE Community Research Infrastructure (CCRI)
- Centers for Innovation and Community Engagement in Solid Earth Geohazards
- Human Networks and Data Science (HNDS)
- Research and Mentoring for Postbaccalaureates in Biological Sciences (RaMP)
- Macrosystems Biology and NEON-Enabled Science (MSB-NES)
- Building Research Capacity of New Faculty in Biology (BRC-BIO)
- Launching Early-Career Academic Pathways in the Mathematical and Physical Sciences (LEAPS-MPS)
- Mathematical and Physical Sciences Ascending Postdoctoral Research Fellowships (MPS-Ascend)
Author Archives: rcmendez217
In Brief
Research Interests Professor Johnsson’s research interests are in the areas of High-Performance and Energy Efficient computer system design, programming and operation, parallel algorithms, adaptive software and tools for creation thereof, auto-tuning, performance modelling, and middle-ware. Multi-core and SoC dsigns are … Continue reading
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